Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

• Tác giả: Nicole Lindenmann
• Ngôn ngữ: eng
• ISBN-13: 978-3731507468
• ISBN: KSP/1000077963
• Ký hiệu phân loại: 621.3 Electrical, magnetic, optical, communications, computer engineering; electronics, lighting
• Thông tin xuất bản: Karlsruhe : KIT Scientific Publishing, 2018
• Mô tả vật lý: 1 electronic resource (XXI, 222 p. p.)
• Bộ sưu tập: Tài liệu truy cập mở
• ID: 203547

Tóm tắt

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.