Machining-Recent Advances, Applications and Challenges

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Tác giả: Luis Norberto López de Lacalle, Gorka Urbicain

Ngôn ngữ: eng

ISBN-13: 978-3039213771

Ký hiệu phân loại:

Thông tin xuất bản: Basel, Switzerland : MDPI - Multidisciplinary Digital Publishing Institute, 2019

Mô tả vật lý: 1 electronic resource (554 p.)

Bộ sưu tập: Tài liệu truy cập mở

ID: 235183

 The Special Issue Machining-Recent Advances, Applications and Challenges is intended as a humble collection of some of the hottest topics in machining. The manufacturing industry is a varying and challenging environment where new advances emerge from one day to another. In recent years, new manufacturing procedures have retained increasing attention from the industrial and scientific community. However, machining still remains the key operation to achieve high productivity and precision for high-added value parts. Continuous research is performed, and new ideas are constantly considered. This Special Issue summarizes selected high-quality papers which were submitted, peer-reviewed, and recommended by experts. It covers some (but not only) of the following topics: High performance operations for difficult-to-cut alloys, wrought and cast materials, light alloys, ceramics, etc.
  Cutting tools, grades, substrates and coatings. Wear damage
  Advanced cooling in machining: Minimum quantity of lubricant, dry or cryogenics
  Modelling, focused on the reduction of risks, the process outcome, and to maintain surface integrity
  Vibration problems in machines: Active and passive/predictive methods, sources, diagnosis and avoidance
  Influence of machining in new concepts of machine-tool, and machine static and dynamic behaviors
  Machinability of new composites, brittle and emerging materials
  Assisted machining processes by high-pressure, laser, US, and others
  Introduction of new analytics and decision making into machining programming. We wish to thank the reviewers and staff from Materials for their comments, advice, suggestions and invaluable support during the development of this Special Issue.
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