Dielectrics for Power Electronics Applications [electronic resource]

• Ngôn ngữ: eng
• Ký hiệu phân loại: 630.4 Agriculture and related technologies
• Thông tin xuất bản: Washington, D.C. : Oak Ridge, Tenn. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2020
• Mô tả vật lý: Size: 1.1 MB : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256106
• Chủ đề: 1. 30 direct energy conversion; 2. Dielectric cooling; 3. Dielectric material; 4. Direct-bond-copper; 5. Finite element analysis; 6. Power electronics

Tóm tắt

This presentation discusses the role of dielectric materials in power electronic packages. Two dielectric technologies - a dielectric material film-based substrate for insulation and a dielectric coolant - are discussed. The thermal performance benefits of dielectric film-based substrate in comparison with traditional direct-bond-copper substrates are studied through finite element analysis. Also, a novel cooling concept based on dielectric liquids that can contact electrically active surfaces are presented.