Advanced Power Electronics Designs - Reliability and Prognostics [electronic resource]

• Ngôn ngữ: eng
• Ký hiệu phân loại: 628.2 Sewers
• Thông tin xuất bản: Washington, D.C. : Oak Ridge, Tenn. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2019
• Mô tả vật lý: Size: 519 KB : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256158
• Chủ đề: 1. 30 direct energy conversion; 2. 33 advanced propulsion systems; 3. Electrical interconnection; 4. Power electronics; 5. Reliability; 6. Thermal modeling; 7. Traction inverter; 8. Wide bandgap

Tóm tắt

The electrical interconnection and isolation design aspects within an inverter must also provide high thermal performance and thermomechanical reliability. In collaboration with ORNL, DuPont, and Indiana Integrated Circuits (IIC), NREL is evaluating new packaging materials and manufacturing techniques for wide-bandgap-based traction inverters. Thermal modeling and experimental evaluation revealed that an organic direct-bond-copper (ODBC) substrate has similar thermal resistance to traditional ceramic substrates. High-temperature thermal cycling has shown the ODBC substrates to have greater reliability than ceramic substrates which is a significant finding in the quest for low-cost, power-dense, high-temperature power electronics. IIC's direct chip-to-chip topside electrical connection will be attached to ODBC substrates and reliability evaluation for both technologies will be performed at NREL in Q4.