Performance and Reliability of Bonded Interfaces for High-Temperature Packaging [electronic resource]

• Ngôn ngữ: eng
• Ký hiệu phân loại: 621.3819 Electrical, magnetic, optical, communications, computer engineering; electronics, lighting
• Thông tin xuất bản: Washington, D.C. : Oak Ridge, Tenn. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2018
• Mô tả vật lý: Size: 3 MB : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256241
• Chủ đề: 1. 25 energy storage; 2. 30 direct energy conversion; 3. Fracture mechanics; 4. Power electronics; 5. Reliability; 6. Sintered silver; 7. Thermal cycling; 8. Thermomechanical modeling

Tóm tắt

The presentation focuses on mechanical characterization, reliability evaluation and thermomechanical modeling of sintered silver bonded interface material. Two types of sintered silver material are being investigated in this study - first one based on nanosilver particles and the other one comprising of a mixture of nanosilver particles and micron-sized silver flakes. Shear stress results obtained as a function of displacement rates and ambient temperature are reported. Also, scanning acoustic microscopy images of samples for accelerated testing and thermomechanical modeling results are presented.