Performance and Reliability of Bonded Interfaces for High-temperature Packaging [electronic resource] : Annual Progress Report

• Ngôn ngữ: eng
• Ký hiệu phân loại: 621.3 Electrical, magnetic, optical, communications, computer engineering; electronics, lighting
• Thông tin xuất bản: Washington, D.C. : Oak Ridge, Tenn. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2017
• Mô tả vật lý: Size: 14 p. : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256302
• Chủ đề: 1. 30 direct energy conversion; 2. Bonded interfaces, high-temperature packaging; 3. Crack propagation; 4. Power electronics; 5. Reliability; 6. Sintered silver; 7. Thermal performance

Tóm tắt

As maximum device temperatures approach 200 �Celsius, continuous operation, sintered silver materials promise to maintain bonds at these high temperatures without excessive degradation rates. A detailed characterization of the thermal performance and reliability of sintered silver materials and processes has been initiated for the next year. Future steps in crack modeling include efforts to simulate crack propagation directly using the extended finite element method (X-FEM), a numerical technique that uses the partition of unity method for modeling discontinuities such as cracks in a system.