Anisotropic Thermal Response of Packed Copper Wire [electronic resource]

• Ngôn ngữ: eng
• Ký hiệu phân loại: 621.312 Generation, modification, storage
• Thông tin xuất bản: Washington, D.C. : Oak Ridge, Tenn. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2017
• Mô tả vật lý: Size: Article No. 041006 : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256346
• Chủ đề: 1. 30 direct energy conversion; 2. 36 materials science; 3. 42 engineering; 4. Apparent thermal conductivity; 5. Et al; 6. Laser flash; 7. Representative volume element; 8. Thermal conductivity percolation; 9. Thermal transmittance; 10. Transient plane source; 11. Transverse isotropy

Tóm tắt

The apparent thermal conductivity of packed copper wire test specimens was measured parallel and perpendicular to the axis of the wire using laser flash, transient plane source, and transmittance test methods. Approximately 50% wire packing efficiency was produced in the specimens using either 670- or 925-?m-diameter copper wires that both had an insulation coating thickness of 37 ?m. The interstices were filled with a conventional varnish material and also contained some remnant porosity. The apparent thermal conductivity perpendicular to the wire axis was about 0.5?1 W/mK, whereas it was over 200 W/mK in the parallel direction. The Kanzaki model and an finite element analysis (FEA) model were found to reasonably predict the apparent thermal conductivity perpendicular to the wires but thermal conductivity percolation from nonideal wire-packing may result in their underestimation of it.