Optical Thermal Characterization Enables High-Performance Electronics Applications [electronic resource]

• Ngôn ngữ: eng
• Ký hiệu phân loại: 621.312 Generation, modification, storage
• Thông tin xuất bản: Washington, D.C. : Oak Ridge, Tenn. : United States. Dept. of Energy. Office of Energy Efficiency and Renewable Energy ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2016
• Mô tả vật lý: Size: 249 KB : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256442
• Chủ đề: 1. 30 direct energy conversion; 2. Electronics packaging; 3. Thermal; 4. Thermal interface materials; 5. Thermoplastics; 6. Tim

Tóm tắt

NREL developed a modeling and experimental strategy to characterize thermal performance of materials. The technique provides critical data on thermal properties with relevance for electronics packaging applications. Thermal contact resistance and bulk thermal conductivity were characterized for new high-performance materials such as thermoplastics, boron-nitride nanosheets, copper nanowires, and atomically bonded layers. The technique is an important tool for developing designs and materials that enable power electronics packaging with small footprint, high power density, and low cost for numerous applications.