Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation) [electronic resource]

• Ngôn ngữ: eng
• Ký hiệu phân loại: 621.38 Electronics, communications engineering
• Thông tin xuất bản: Golden, Colo. : Oak Ridge, Tenn. : National Renewable Energy Laboratory (U.S.) ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2014
• Mô tả vật lý: Size: 20 pp. : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256556
• Chủ đề: 1. 30 direct energy conversion; 2. 33 advanced propulsion systems; 3. Bonded interfaces; 4. Delamination; 5. Reliability; 6. Sintered-silver; 7. Stress intensity factor

Tóm tắt

The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.