Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation) [electronic resource]

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Tác giả:

Ngôn ngữ: eng

Ký hiệu phân loại: 621.38 Electronics, communications engineering

Thông tin xuất bản: Golden, Colo. : Oak Ridge, Tenn. : National Renewable Energy Laboratory (U.S.) ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2014

Mô tả vật lý: Size: 20 pp. : , digital, PDF file.

Bộ sưu tập: Metadata

ID: 256556

The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.
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