Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs) [electronic resource] : Preprint

• Ngôn ngữ: eng
• Ký hiệu phân loại: 621.3815 Electrical, magnetic, optical, communications, computer engineering; electronics, lighting
• Thông tin xuất bản: Golden, Colo. : Oak Ridge, Tenn. : National Renewable Energy Laboratory (U.S.) ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2014
• Mô tả vật lý: Size: 11 pp. : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256585
• Chủ đề: 1. 30 direct energy conversion; 2. 33 advanced propulsion systems; 3. Accelerated testing; 4. Bonded interface material; 5. Thermal interface; 6. Thermal resistance; 7. Transportation

Tóm tắt

 Thermal interface materials are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistivity (<
  1 mm2K/W). However, BIMs induce thermomechanical stresses in the package and can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. DARPA's Thermal Management Technologies program has addressed this challenge, supporting the development of mechanically-compliant, low resistivity nano-thermal interface (NTI) materials. In this work, we describe the testing procedure and report the results of NREL's thermal performance and reliability characterization of an initial sample of four different NTI-BIMs.