Stress Intensity of Delamination in a Sintered-Silver Interconnection [electronic resource] : Preprint

• Ngôn ngữ: eng
• Ký hiệu phân loại: 621.38 Electronics, communications engineering
• Thông tin xuất bản: Golden, Colo. : Oak Ridge, Tenn. : National Renewable Energy Laboratory (U.S.) ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2014
• Mô tả vật lý: Size: 10 pp. : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 256588
• Chủ đề: 1. 30 direct energy conversion; 2. 33 advanced propulsion systems; 3. Bonded interfaces; 4. Delamination; 5. Reliability; 6. Sintered-silver; 7. Stress intensity; 8. Transportation

Tóm tắt

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.