Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation) [electronic resource]

• Ngôn ngữ: eng
• Ký hiệu phân loại: 621.3 Electrical, magnetic, optical, communications, computer engineering; electronics, lighting
• Thông tin xuất bản: Washington, D.C. : Oak Ridge, Tenn. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2013
• Mô tả vật lý: Size: 3.6 MB : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 267266
• Chủ đề: 1. 33 advanced propulsion systems; 2. Bonded interfaces; 3. Electronics packaging applications; 4. Power electronics; 5. Thermal performance

Tóm tắt

This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.