Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation) [electronic resource]

• Ngôn ngữ: eng
• Ký hiệu phân loại: 628.2 Sewers
• Thông tin xuất bản: Washington, D.C. : Oak Ridge, Tenn. : United States. Dept. of Energy. Office of Energy Efficiency and Renewable Energy ; Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2010
• Mô tả vật lý: Size: 1.4 MB : , digital, PDF file.
• Bộ sưu tập: Metadata
• ID: 267650
• Chủ đề: 1. 30 direct energy conversion; 2. 32 energy conservation, consumption, and utilization; 3. 33 advanced propulsion systems; 4. Configuration; 5. Management

Tóm tắt

Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of coolingtechnologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package.The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.