Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging

• Tác giả: Xing-Chang Wei
• Ngôn ngữ: eng
• ISBN: 9781138033566 (hardback : alk. paper)
• Ký hiệu phân loại: 621.381531 Electrical, magnetic, optical, communications, computer engineering; electronics, lighting
• Mô tả vật lý: xviii, 322 pages ; , 24 cm
• Bộ sưu tập: Khoa học ứng dụng
• ID: 284886
• Chủ đề: 1. Electromagnetic compatibility; 2. Electronic packaging; 3. Printed circuits--Design and construction

Includes bibliographical references and index.