Chemical-Mechanical Planarization of Semiconductor Materials [electronic resource]

• Tác giả: M.R Oliver
• ISBN-13: 978-3662062340
• Ký hiệu phân loại: 620.112 Properties of materials and nondestructive testing
• Thông tin xuất bản: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2004.
• Mô tả vật lý: XI, 428 p. , online resource.
• Bộ sưu tập: Tài liệu truy cập mở
• ID: 307935
• Chủ đề: 1. Electronics; 2. Manufactures; 3. Materials-Analysis; 4. Physical chemistry; 5. Surfaces (Technology)

Tóm tắt

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.