Routing in the third dimension : from VLSI chips to MCMs

• Tác giả: Siddharth Bhingarde, Anand Panyam, N. A Sherwani
• Ngôn ngữ: eng
• ISBN-13: 978-0470546376
• Ký hiệu phân loại: 621.395 Circuitry
• Thông tin xuất bản: Piscataway, New Jersey : IEEE Press, 1995.
• Mô tả vật lý: 1 PDF (xviii, 358 pages) : , illustrations.
• Bộ sưu tập: Tài liệu truy cập mở
• ID: 314141
• Chủ đề: 1. Integrated circuits--Very large scale integration; 2. Multichip modules (Microelectronics)--Computer-aided design

Includes bibliographical references (p. 335-350) and indexes.

Tóm tắt

This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.