Hybrid photonic assemblies based on 3D-printed coupling structures

• Tác giả: Yilin Xu
• Ngôn ngữ: eng
• ISBN: KSP/1000154744
• Thông tin xuất bản: KIT Scientific Publishing 2023
• Mô tả vật lý: 1 electronic resource (292 p.)
• Bộ sưu tập: Tài liệu truy cập mở
• ID: 345003
• Chủ đề: 1. Electrical engineering

Tóm tắt

Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).