Vật liệu kỵ nước - khả năng chế tạo bằng công nghệ điện hóa

• Tác giả: Thanh Thùy Đào, Thị Phương Thảo Lê, Đức Hùng Nguyễn
• Ngôn ngữ: vie
• Ký hiệu phân loại: 332.673 International investment
• Thông tin xuất bản: Hóa học, 2012
• Mô tả vật lý: 45420
• Bộ sưu tập: Metadata
• ID: 645678

Tóm tắt

Hydrophobic film on copper metal was fabricated by electrochemical technology. Via electroplating at higher current densities than limit line, Cu plating formed from solution of CuSO4 0.08 M and H2SO4 0.06 M reached a hierarchical structure: contact angles of water droplets were greater than 90° without any modification by low surface energy materials. The hydrophobic Cu-TiO2 combination electroplating was formed in the same electroplating condition. At 3 g/l TiO2 in electrolyte solution, the combination of TiO2 in the plating was the best.