Microstructure and properties of electroless Ni-P/Sn2.5Ag0.7Cu0.1RE micro-joints during thermomigration.

• Tác giả: Ruiqing Hou, Yonglei Wang, Chao Zhang, Haizhou Zhang, Keke Zhang, Wenjia Zhao
• Ngôn ngữ: eng
• Ký hiệu phân loại: 025.315 *Structure
• Thông tin xuất bản: England : Scientific reports , 2025
• Bộ sưu tập: NCBI
• ID: 696377
• Chủ đề: 1. Microstructure; 2. And; 3. Properties

Tóm tắt

The Ni-P stratum was fabricated upon the Cu substrate via an electroless plating technique, and the microstructure and properties of electroless Ni-P/Sn2.5Ag0.7Cu0.1RE micro-joints under temperature gradient was studied. Research indicates that in the initial stage of thermomigration in micro-solder joints, the intermetallic compound (IMC) in the Ni-P/soldering seam transition area appears as both "needle-shaped" and "block-shaped" (Ni, Cu)