Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique.

• Tác giả: Xiuwen Bi, Xiaochen Chen, Wei He, Wen Huang, Lei Sang, Quhuan Shen, Xianchao Wei, Tao Yuan, Hanlin Zhang, Zihan Zhang, Zhikun Zhou
• Ngôn ngữ: eng
• Thông tin xuất bản: England : Nature communications , 2025
• Bộ sưu tập: NCBI
• ID: 711423

Tóm tắt

A wafer-scale metal self-rolled-up membrane platform has been proposed for the design and fabrication of radio-frequency on-chip lumped passive components, which is demonstrated on a commercial 4-inch sapphire batch fabrication line. Compared to the traditional methodology including planar or SiN