The formation of a high-density nanotwinned structure in copper deposits is presently acknowledged as a paramount goal for enhancing the material characteristics of copper. However, the conventional manufacturing processes often involve the incorporation of organic additives, resulting in consequential impurity effects and aging concerns. In this work, we introduce a high-rate approach to fabricate (220)-orientation nanotwinned copper foils in a concentrated methanesulfonate copper solution with mere amount of chloride ions as additives. This solution exhibits a plating capability of 60 A dm