Sensor miniaturization offers significant advantages, including enhanced SoC integration efficiency, reduced cost, and lightweight design. While the roll-to-roll printed electronics fabrication process is advantageous for the mass production of sensors compared to the traditional MEMS technology, producing sensors that require air gap-based 3D structures remains challenging. This study proposes an integration of roll-to-roll gravure printing with a transferring and bonding method for touch sensor fabrication. Unlike previously reported methods for sacrificial layer removal, this approach prevents stiction issues, thus enabling sensor miniaturization and providing the flexibility to select materials that minimize sensitivity degradation during scaling. For the lower part of the sensor, Ag and BaSO