Different microstructures significantly affect the acoustic performance of MEMS capacitive microphones, particularly in key specifications of interest. This paper presents several microstructures, including rib-reinforced backplates, suspended diaphragms, and outer vent holes. Three MEMS microphone designs were implemented to analyze the impact of these microstructures. Equivalent circuit models corresponding to each design were constructed to simulate specifications such as sensitivity, signal-to-noise ratio (SNR), and low corner frequency (LCF), which were validated through experimental measurements. Finite Element Analysis (FEA) was also employed to calculate the acoustic damping of certain microstructures, the mechanical lumped parameters of the diaphragm, and the pre-deformation of the MEMS structure. A compressed air test (CAT) was conducted to evaluate the mechanical reliability of microphone samples. The results of simulations and measurements indicate that rib-reinforced backplates effectively improve microphone reliability, increasing the pass rate in CAT. Compared to fully clamped diaphragms, suspended diaphragms exhibit higher mechanical compliance, which enhances SNR performance but reduces AOP. Outer vent holes can achieve similar functionality to diaphragm vent holes, but their impact on improving AOP requires further design and testing.