Semiconductor Packaging : Materials Interaction and Reliability
	Tác giả: Andrea Chen, Randy Hsiao-Yu Lo
	Xuất bản: Boca Raton FL: Taylor Francis, 2012
	Bộ sưu tập: Tài liệu truy cập mở
	eBook (pdf) ddc:  621.38152  Thêm vào giỏ

Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation) [electronic resource]
	Tác giả:
	Xuất bản: Washington DC Oak Ridge Tenn: United States Office of the Assistant Secretary of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2013
	Bộ sưu tập: Metadata
	ddc:  621.3  Thêm vào giỏ

Performance and Reliability of Bonded Interfaces for High-temperature Packaging [electronic resource] : Annual Progress Report
	Tác giả:
	Xuất bản: Washington DC Oak Ridge Tenn: United States Office of the Assistant Secretary of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2017
	Bộ sưu tập: Metadata
	ddc:  621.3  Thêm vào giỏ

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation) [electronic resource]
	Tác giả:
	Xuất bản: Golden Colo Oak Ridge Tenn: National Renewable Energy Laboratory US Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2014
	Bộ sưu tập: Metadata
	ddc:  629.8  Thêm vào giỏ

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging [electronic resource]
	Tác giả:
	Xuất bản: Washington DC Oak Ridge Tenn: United States Office of the Assistant Secretary of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2018
	Bộ sưu tập: Metadata
	ddc:  621.3819  Thêm vào giỏ

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. Annual Report [electronic resource]
	Tác giả:
	Xuất bản: Washington DC Oak Ridge Tenn: United States Office of the Assistant Secretary of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2016
	Bộ sưu tập: Metadata
	ddc:  621.38  Thêm vào giỏ

Air-Cooled Heat Exchanger for High-Temperature Power Electronics [electronic resource] : Preprint
	Tác giả:
	Xuất bản: Washington DC Oak Ridge Tenn: United States Office of the Assistant Secretary of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2015
	Bộ sưu tập: Metadata
	ddc:  629.89  Thêm vào giỏ

Optical Thermal Characterization Enables High-Performance Electronics Applications [electronic resource]
	Tác giả:
	Xuất bản: Washington DC Oak Ridge Tenn: United States Dept of Energy Office of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2016
	Bộ sưu tập: Metadata
	ddc:  621.312  Thêm vào giỏ

Thermal and Thermomechanical Modeling to Design a Gallium Oxide Power Electronics Package [electronic resource] : Preprint
	Tác giả:
	Xuất bản: Golden Colo Oak Ridge Tenn: National Renewable Energy Laboratory US Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2019
	Bộ sưu tập: Metadata
	ddc:  621.3  Thêm vào giỏ

Thermal Management of Power Electronics and Electric Motors for Electric-Drive Vehicles (Presentation) [electronic resource]
	Tác giả:
	Xuất bản: Golden Colo Oak Ridge Tenn: National Renewable Energy Laboratory US Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2014
	Bộ sưu tập: Metadata
	ddc:  621.3  Thêm vào giỏ